STMP3780XXBBEA5N Product Information|NXP

Features


Huashan TA5 ROM 169BGA

    Package


    LFBGA169: LFBGA169, plastic, low profile fine-pitch ball grid array; 169 balls; 0.8 mm pitch; 11 mm x 11 mm x 1.02 mm body

    Buy Options

    STMP3780XXBBEA5N

    End of Life

    12NC: 935319618557

    Details

    Order

    Operating Features

    No information available

    Environmental

    Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
    STMP3780XXBBEA5N(935319618557)
    Yes
    Yes
    Certificate Of Analysis (CoA)
    Yes
    D
    e1
    REACH SVHC
    280.4

    Quality

    Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
    Lead Free SolderingLead Free SolderingLead Free Soldering
    STMP3780XXBBEA5N
    (935319618557)
    No
    3
    260
    40

    Shipping

    Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
    STMP3780XXBBEA5N
    (935319618557)
    854231
    5A992

    Product Change Notice

    Part/12NCIssue DateEffective DatePCNTitle
    STMP3780XXBBEA5N
    (935319618557)
    2025-04-162025-05-26202504009IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
    STMP3780XXBBEA5N
    (935319618557)
    2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label