STMP3770XXBJEA3N Product Information|NXP

Features


Piano 2p0 TA3 ROM Revision

    Package


    VFBGA100: VFBGA100, plastic, very thin fine-pitch ball grid array; 100 balls; 0.5 mm pitch; 6 mm x 6 mm x 0.66 mm body

    Buy Options

    STMP3770XXBJEA3N

    End of Life

    12NC: 935324364557

    Details

    Order

    Operating Features

    No information available

    Environmental

    Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
    STMP3770XXBJEA3N(935324364557)
    Yes
    Yes
    Certificate Of Analysis (CoA)
    Yes
    D
    e1
    REACH SVHC
    64.6

    Quality

    Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
    Lead Free SolderingLead Free SolderingLead Free Soldering
    STMP3770XXBJEA3N
    (935324364557)
    No
    3
    260
    40

    Shipping

    Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
    STMP3770XXBJEA3N
    (935324364557)
    854231
    5A992C

    Product Change Notice

    Part/12NCIssue DateEffective DatePCNTitle
    STMP3770XXBJEA3N
    (935324364557)
    2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label