SPC5675KFK0MMM2 Product Information|NXP

Package


LFBGA257: LFBGA257, plastic, low profile fine-pitch ball grid array package; 257 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.35 mm body

Buy Options

Operating Features

No information available

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
SPC5675KFK0MMM2(935371937557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
407.2

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
SPC5675KFK0MMM2
(935371937557)
Quality Managed
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
SPC5675KFK0MMM2
(935371937557)
854231
3A991A2

Discontinued and Replacement Part Data

Part/12NCDiscontinuance NoticeLast Time Buy DateLast Time Delivery DateReplacement
SPC5675KFK0MMM2
(935371937557)
NOTICE
2020-08-31
2020-11-30
-

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
SPC5675KFK0MMM2
(935371937557)
2025-04-162025-05-26202504009IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
SPC5675KFK0MMM2
(935371937557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
SPC5675KFK0MMM2
(935371937557)
2020-03-202020-03-21201908018DNU01Cancellation of Discontinuation Notification For MPC5675K 257MAPBGA With 0.7mm Mold Cap Height
SPC5675KFK0MMM2
(935371937557)
2019-12-032019-12-04201908018DNDiscontinuation Notification For MPC5675K 257MAPBGA With 0.7mm Mold Cap Height