S9S12XS64J1MAE Product Information|NXP

Features


16-bit MCU, S12X core, 64KB Flash, 40MHz, -40/+125degC, Automotive Qualified, QFP 64

Package


LQFP64: LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body

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S9S12XS64J1MAE

Active

12NC: 935317041557

Details

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Operating Features

ParameterValue
Flash (kB)
64
RAM (kB)
4
EEPROM (kB)
4
Operating Frequency [Max] (MHz)
40
CAN
1
ParameterValue
SPI
1
Supply Voltage [max] (V)
5.5
Supply Voltage [min] (V)
3.13
Ambient Operating Temperature (Min to Max) (℃)
-40 to 125
GPIO
44

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
S9S12XS64J1MAE(935317041557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e4
REACH SVHC
346.55

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
S9S12XS64J1MAE
(935317041557)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
S9S12XS64J1MAE
(935317041557)
854231
3A991A2

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
S9S12XS64J1MAE
(935317041557)
2025-04-162025-05-26202504008IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
S9S12XS64J1MAE
(935317041557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label

More about S12XS

The S12XS 16-bit MCU family is optimized for a broad range of cost-sensitive automotive body electronics applications.

Addressing customer needs for design flexibility and platform compatibility, the S12X products enable scalability, hardware and software reusability and compatibility across a broad array of automotive electronics platforms.

The S12XS automotive MCU family allows you to quickly react to market opportunities while reducing the cost of migration if application requirements change during your development cycle.

Compact packaging makes these devices suitable for space-constrained applications, such as small actuators, sensor modules and column-integrated modules.

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