Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
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Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
BGA783: BGA783, plastic, ball grid array; 783 bumps; 1.0 mm pitch; 29 mm x 29 mm x 3.58 mm body
12NC: 935319997557
Details
Order
Parameter | Value |
---|---|
Security Status | COMPANY PUBLIC |
Description | StarCore DSP, 4x 1GHz SC3850 cores, DDR2/3, SRIO, PCIe, QE, GbE, -40-105C |
Parameter | Value |
---|---|
Number of pins | 783 |
Package Style | BGA |
Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
---|---|---|---|---|---|---|---|
MSC8254TAG1000B(935319997557) | Yes | Yes Certificate Of Analysis (CoA) | Yes | e1 | REACH SVHC | 11142.7 |
Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
---|---|---|---|---|---|---|---|
Lead Free Soldering | Lead Free Soldering | Lead Free Soldering | |||||
MSC8254TAG1000B (935319997557) | No | 3 | 245 | 30 |
Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) | Footprint | Capture Symbol |
---|---|---|---|---|
MSC8254TAG1000B (935319997557) | 854231 | 3A991A1 | PDF | Cadence Allegro(dra) | PDF | Orcad Capture 16.3(olb) |
Part/12NC | Discontinuance Notice | Last Time Buy Date | Last Time Delivery Date |
---|---|---|---|
MSC8254TAG1000B (935319997557) | - | 2017-06-01 | 2017-12-01 |
Part/12NC | Issue Date | Effective Date | PCN | Title |
---|---|---|---|---|
MSC8254TAG1000B (935319997557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MSC8254TAG1000B (935319997557) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
Archived content is no longer updated and is made available for historical reference only.
The MSC8254 is based on the industry's highest-performance DSP core built on StarCore® technology and designed for the advanced processing requirements and capabilities of today’s high-performance medical imaging, aerospace, defense and advanced test and measurement markets. It delivers higher performance and power savings, leveraging 45 nm process technology in a highly integrated system-on-chip (SoC) to provide performance equivalent to 4 GHz of a single-core device. The MSC8254 helps equipment manufacturers create end products and services that integrate more functionality in a smaller hardware footprint.
The MSC8254 DSP delivers a high level of performance and integration, combining four fully programmable enhanced, SC3850 DSP cores, each running at up to 1 GHz. The SC3850 DSP core has been independently assessed to enable 40 percent more processing capability per MHz than the nearest DSP competition. A high-performance internal RISC-based QUICC Engine® subsystem supports multiple networking protocols to guarantee reliable data transport over packet networks while significantly offloading processing from the DSP cores.
The MSC8254 embeds a substantial amount of internal memory to support a variety of advanced high-speed interface types, including two RapidIO® interfaces, two gigabit Ethernet interfaces for network communications, a PCI Express® controller, two DDR controllers for high-speed, industry standard memory interface and four multichannel TDM interfaces. The MSC8254 allows a high degree of scalability through pin compatibility with all MSC825x and MSCC815x DSP devices.