Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
- No Longer Manufactured
- MSC8122TVT6400V
Package
FBGA431: FBGA431, plastic, fine-pitch ball grid array; 431 balls; 0.8 mm pitch; 20 mm x 20 mm x 3.3 mm body
Buy Options
MSC8122TVT6400V
End of Life
12NC: 935322783557
Details
Order
Operating Features
| Parameter | Value |
|---|---|
Security Status | COMPANY PUBLIC |
Description | PBGA,NOPB,1.1V,105C,400MHZ |
| Parameter | Value |
|---|---|
Number of pins | 431 |
Package Style | FBGA |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
MSC8122TVT6400V(935322783557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e2 | REACH SVHC | 2546.1 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Free Soldering | Lead Soldering | Lead Free Soldering | Lead Soldering | Lead Free Soldering | |||
MSC8122TVT6400V (935322783557) | No | 3 | 250 | 250 | 30 | 30 | |
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) |
|---|---|---|
MSC8122TVT6400V (935322783557) | 854231 | 3A991A2 |
Product Change Notice
| Part/12NC | Issue Date | Effective Date | PCN | Title |
|---|---|---|---|---|
MSC8122TVT6400V (935322783557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MSC8122TVT6400V (935322783557) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
More about MSC8122
Archived content is no longer updated and is made available for historical reference only.
The MSC8122 is a highly integrated system-on-a-chip that combines four StarCore® SC140 extended cores with an RS-232 serial interface, four time-division multiplexed (TDM) serial interfaces, thirty-two general-purpose timers, a flexible system interface unit (SIU), an Ethernet interface, and a multi-channel DMA controller. The four extended cores can deliver a total 4800/6400/8000 DSP MMACS performance at 300/400/500 MHz.
Each core has four arithmetic logic units (ALUs), internal memory, a write buffer, and two interrupt controllers. The MSC8122 targets high-bandwidth highly computational DSP applications and is optimized for wireless transcoding and packet telephony as well as high-bandwidth base station applications. The MSC8122 delivers enhanced performance while maintaining low power dissipation and greatly reduces system cost.
The MSC8122 device is designed to provide an optimal solution for 3G wireless base stations, to help eliminate many of the costly and power hungry ASICs and FPGAs required in today's systems for both symbol rate and for chip rate assist. In addition, the MSC8122 device allows customers to add next-generation features that efficiently use available frequencies and higher bit rates in 3G systems.
Efficient application software development is key in Our strategy to expedite customer's time-to-market. Developers can take advantage of development tools and real-time operating systems (RTOS) from NXP® and third-party suppliers. In addition NXP is partnering with third-party vendors to provide integrated systems solutions that include GSM, CDMA, TDMA, and ITU G.7xx speech coders, hybrid echo cancellation, fax, modem, and xDSL software.