MCF5474ZP200 Product Information|NXP

Features


MCF547X V4ECORE MMU, FPU

    Package


    BGA388: BGA388, plastic ball grid array package; 388 balls; 1 mm pitch; 27 mm x 27 mm x 1.95 mm body

    Buy Options

    Operating Features

    No information available

    Environmental

    Part/12NCPbFreeEU RoHSRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
    MCF5474ZP200(935309497557)
    No
    No
    N
    e0
    REACH SVHC
    3416.7

    Quality

    Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
    Lead SolderingLead SolderingLead Soldering
    MCF5474ZP200
    (935309497557)
    No
    3
    260
    40

    Shipping

    Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
    MCF5474ZP200
    (935309497557)
    854231
    3A991A2

    Discontinued and Replacement Part Data

    Part/12NCDiscontinuance NoticeReplacement
    MCF5474ZP200
    (935309497557)
    -
    MCF5474VR200
    (935322689557)

    Product Change Notice

    Part/12NCIssue DateEffective DatePCNTitle
    MCF5474ZP200
    (935309497557)
    2025-04-162025-05-26202504007IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
    MCF5474ZP200
    (935309497557)
    2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label