MC33389DDW Product Information|NXP

Features


System basis chip

    Package


    SO28: SO28, plastic, small outline package; 28 terminals; 1.27 mm pitch; 7.5 mm x 17.93 mm x 2.35 mm body

    Buy Options

    Operating Features

    No information available

    Environmental

    Part/12NCPbFreeEU RoHSRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
    MC33389DDW(935316539574)
    No
    No
    N
    e0
    REACH SVHC
    756.25
    MC33389DDWR2(935316539518)
    No
    No
    N
    e0
    REACH SVHC
    756.25

    Quality

    Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
    Lead SolderingLead SolderingLead Soldering
    MC33389DDW
    (935316539574)
    No
    3
    220
    30
    MC33389DDWR2
    (935316539518)
    No
    3
    220
    30

    Shipping

    Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
    MC33389DDW
    (935316539574)
    854231
    EAR99
    MC33389DDWR2
    (935316539518)
    854231
    EAR99

    Discontinued and Replacement Part Data

    Part/12NCDiscontinuance NoticeLast Time Buy DateLast Time Delivery DateReplacement
    MC33389DDW
    (935316539574)
    -
    2011-01-15
    2012-05-31
    None
    MC33389DDWR2
    (935316539518)
    -
    2011-01-15
    2012-05-31
    None

    Product Change Notice

    Part/12NCIssue DateEffective DatePCNTitle
    MC33389DDW
    (935316539574)
    2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
    MC33389DDWR2
    (935316539518)