KCU8313ZQAFFC Product Information|NXP

KCU8313ZQAFFC

No Longer Manufactured

KCU8313ZQAFFC

No Longer Manufactured

Features


PowerQUICC, 32 Bit Power Architecture SoC, 333MHz, DDR1/2, PCI, GbE, USB, 0 to 105C, Rev 3

    Package


    HBGA516: HBGA516, plastic, thermal enhanced ball grid array; 516 balls; 1 mm pitch; 27 mm x 27 mm x 2.55 mm body

    Buy Options

    KCU8313ZQAFFC

    No Longer Manufactured

    12NC: 935322091557

    Details

    Order

    Operating Features

    No information available

    Environmental

    Part/12NCPbFreeEU RoHSRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
    KCU8313ZQAFFC(935322091557)
    No
    No
    N
    e0
    REACH SVHC
    5670.85

    Quality

    Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
    Lead SolderingLead SolderingLead Soldering
    KCU8313ZQAFFC
    (935322091557)
    No
    3
    260
    40

    Shipping

    Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
    KCU8313ZQAFFC
    (935322091557)
    854231
    3A991A2

    Product Change Notice

    Part/12NCIssue DateEffective DatePCNTitle
    KCU8313ZQAFFC
    (935322091557)
    2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label