KCU8313ECVRADDC Product Information|NXP

KCU8313ECVRADDC

No Longer Manufactured

KCU8313ECVRADDC

No Longer Manufactured

Features


PowerQUICC, 32 Bit Power Architecture SoC, 266MHz, DDR1/2, PCI, GbE, USB, SEC, -40 to 105C, Rev 3

    Package


    HBGA516: HBGA516, plastic, thermal enhanced ball grid array; 516 balls; 1 mm pitch; 27 mm x 27 mm x 2.55 mm body

    Buy Options

    KCU8313ECVRADDC

    No Longer Manufactured

    12NC: 935324871557

    Details

    Order

    Operating Features

    No information available

    Environmental

    Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
    KCU8313ECVRADDC(935324871557)
    Yes
    Yes
    Certificate Of Analysis (CoA)
    Yes
    D
    e2
    REACH SVHC
    5496.9

    Quality

    Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
    Lead Free SolderingLead Free SolderingLead Free Soldering
    KCU8313ECVRADDC
    (935324871557)
    No
    3
    260
    40

    Shipping

    Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)CCATS
    KCU8313ECVRADDC
    (935324871557)
    854231
    5A002A1
    G145003

    Product Change Notice

    Part/12NCIssue DateEffective DatePCNTitle
    KCU8313ECVRADDC
    (935324871557)
    2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label