FS32R372SBK0MMMT Product Information|NXP

Package


LFBGA257: LFBGA257, plastic, low profile fine-pitch ball grid array package; 257 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.35 mm body

Buy Options

FS32R372SBK0MMMT

NRND

12NC: 935369837557

Details

Order

Order from distributors

Operating Features

No information available

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
FS32R372SBK0MMMT(935369837557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
407.2

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
FS32R372SBK0MMMT
(935369837557)
ISO 26262
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)CCATS
FS32R372SBK0MMMT
(935369837557)
854231
5A992C
G175701

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
FS32R372SBK0MMMT
(935369837557)
2025-04-162025-05-26202504006IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
FS32R372SBK0MMMT
(935369837557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label