DSP56321VF200 Product Information|NXP

Features


HIP7 56321 200MHZ DSP

    Package


    BGA196: BGA196, plastic, ball grid array; 196 balls; 1 mm pitch; 15 mm x 15 mm x 1.18 mm body

    Buy Options

    Operating Features

    No information available

    Environmental

    Part/12NCPbFreeEU RoHSRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
    DSP56321VF200(935316503557)
    No
    No
    N
    e0
    REACH SVHC
    638.7

    Quality

    Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
    Lead SolderingLead SolderingLead Soldering
    DSP56321VF200
    (935316503557)
    No
    3
    220
    30

    Shipping

    Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
    DSP56321VF200
    (935316503557)
    854231
    3A991A2

    Discontinued and Replacement Part Data

    Part/12NCDiscontinuance NoticeReplacement
    DSP56321VF200
    (935316503557)
    -
    DSP56321VL200
    (935323905557)

    Product Change Notice

    Part/12NCIssue DateEffective DatePCNTitle
    DSP56321VF200
    (935316503557)
    2025-04-162025-05-26202504006IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
    DSP56321VF200
    (935316503557)
    2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label