Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Package
SOT1261: plastic, thermal enhanced super thin quad flat package; no leads; 12 terminals; body 2.0 x 2.0 x 0.3 mm
Buy Options
BGS8324X
No Longer Manufactured
12NC: 934068936115
Details
Order
Operating Features
| Parameter | Value |
|---|---|
Number of pins | 12 |
Package Style | HXQFN |
Product Application | 200/8 |
Pi(1dB) [typ] (dBm) | 7 |
Security Status | COMPANY PUBLIC |
Application | 200/8 |
Target Applications | 200/8 |
Supply Current (TYP) (mA) | 8, 8.3 |
Icc, gain (mA) (typ) | 8.3 |
Description | WLAN LNA + switch |
Icc, bypass (uA) (typ) | 8 |
Noise Figure (Typ) (dB) | 2 |
Programming Voltage (TYP) (V) | 200/8 |
Input 3rd Order Intercept (dBm) | 7 |
| Parameter | Value |
|---|---|
Gain bypass (dB) (Typ) | -6 |
Supply Current (Typ) (μA) | 8000, 8300 |
NF (dB) | 2.0 |
IP3i (dBm) | 7.0 |
NF @Gp= 5 dB (dB) | 2 |
NF [typ] (dB) | 2 |
ICC [typ] (mA) | 8.3 |
Icc, TX/BT (dB) (Typ) | 200/8 |
Gass (dB) | 16 |
Gconv [typ] (dB) | 16 |
High Current GPIOS / EVDD | 200/8 |
Type Classification | 200/8 |
NXP_Gp [typ] (dB) | 16 |
Input 3rd Order Intercept (dBm) | 7 |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|
BGS8324X(934068936115) | Yes | Yes | Yes |  | REACH SVHC | 0.0 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | ||
|---|---|---|---|---|---|
| Lead Soldering | Lead Free Soldering | Lead Soldering | Lead Free Soldering | ||
BGS8324X (934068936115) | - | tbf | tbf | 240 | 260 |
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer |
|---|---|
BGS8324X (934068936115) | 854239 |
More about BGS8324
The BGS8324 is, also known as the WLAN3001H, a fully integrated Low-Noise Amplifier (LNA) and SP3T switch for Bluetooth path and transmit path. For WLAN applications in the 2.4 GHz to 2.5 GHz ISM band. The BGS8324 is manufactured using NXPs high performance QUBiC eighth generation SiGe:C technology. The BGS8324 couples noise figure, linearity and low insertion loss CMOS switches with the process stability and ruggedness that are the hallmarks of SiGe technology. The BGS8324 has a 2.0 mm × 2.0 mm footprint HX2QFN12 package and a thickness of 300 μm.