i.MX 8XLite Pre-Production Samples

  • This page contains information on a preproduction product. Specifications and information herein are subject to change without notice. For additional information contact support or your sales representative.

Product Details

Block Diagram

i.MX 8XLite Block Diagram

i.MX 8XLite Block Diagram

Features

Processor Complex

  • 2x-1x Arm® Cortex®-A35 cores
  • 1x Cortex-M4F core for real-time processing

Memory

  • 16-bit DDR3L-1866 and LPDDR4-2400
  • 1x FlexSPI for fast boot from SPI NOR flash
  • 2x SD 3.0 card interfaces
  • 1x eMMC5.1/SD3.0
  • NAND (62-bit ECC support)
  • ECC Capabilities
    • Cortex-A35 L1 cache parity
    • Cortex-A35 L2 cache ECC
    • ECC Protection on DDR interface

Connectivity

  • 2x USB 2.0
  • 1x 1Gb Ethernet with AVB
  • 1x 1Gb Ethernet with TSN
  • 3x CAN / CAN FD
  • 4x UART, 1x UART (Cortex M4F Dedicated)
  • PCIe 3.0 (1-lane) with L1 substate
  • 1x ADC converter (6-channels)
  • 4x LPSPI, 4x SAI, 1x ASRC, 4x PWM
  • 4x I2C (High-speed), 1x I2C (Cortex M4F Dedicated)
  • 1x SPDIF

Security

  • High Assurance Boot, SHE
  • TRNG, AES-128, AES-256, 3DES, ARC4, RSA4096, SHA-1, SHA-2, SHA-256, MD-5
  • RSA-1024, 2048, 3072, 4096 and secure key storage
  • Tamper-pins
  • Inline Encryption Engine (AES-128)
  • V2X Optimized High Security Module (HSM)

Temperature

  • Automotive: -40° to 125° C Tj (AEC-Q100 Grade 2)
  • Industrial: -40° to 105° C Tj

Advanced Power Management

  • Recommended PMIC: PF7100 power management integrated circuit for i.MX 8XLite family.

Support

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