SOT2084-2: HWFLGA18


Overview

HWFLGA18, thermal enhanced very-very thin fine-pitched land grid array package, 18 terminals, 0.4 mm pitch, 2.4 mm x 2 mm x 0.64 mm body
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HWFLGA18 surface mount bottom LGA 2.4 x 2 x 0.64 18
Manufacture Code Reference Codes Issue Date
98ASA01732D 2022-08-17
Part Description Quick access
Wi-Fi 7, Wi-Fi 6E and Bluetooth Front-End IC, 2.4 GHz
Wi-Fi 6 and Bluetooth Front-End IC, 2.4 GHz