NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
S9S12DG12F1MPVER
Package Description:
LQFP 112 20*20*1.4P0.65
Tracking Number:
K00006D200
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, Copper
RoHS CoA
Copper Lead Frame
RoHS CoA
Die Encapsulant
RoHS CoA
Epoxy Die Attach
RoHS CoA
Lead Frame Plating
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
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