Subcomponent Description |
Homogeneous Material Identification |
RoHS CoA |
Bonding Wire, Copper |
|
RoHS CoA
|
Die Encapsulant, Halogen-free |
|
RoHS CoA
|
Epoxy Die Attach |
|
RoHS CoA
|
Organic Substrate, Halogen-free |
AUS308 |
RoHS CoA
|
|
E679 |
RoHS CoA
|
Silicon Semiconductor Die |
|
RoHS CoA
|
Solder Balls - Pb Free, Sn/Ag |
|
RoHS CoA
|