| Subcomponent Description |
Homogeneous Material Identification |
RoHS CoA |
| Bonding Wire, Copper |
|
RoHS CoA
|
| Die Encapsulant, Halogen-free |
|
RoHS CoA
|
| Non-Conductive Epoxy/Adhesive |
|
RoHS CoA
|
| Organic Substrate |
E679FGBM |
RoHS CoA
|
|
AUS 308 |
RoHS CoA
|
| Silicon Semiconductor Die |
|
RoHS CoA
|
| Solder Balls - Lead Free |
|
RoHS CoA
|