NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
MC9S08QA2CFQE
Package Description:
QFN-D 8EP 4SQ*1.0P0.8
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, Copper
RoHS CoA
Copper Lead Frame
CDA 194 + NIPDAU
RoHS CoA
Die Encapsulant, Halogen-free
RoHS CoA
Epoxy Die Attach
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
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