| ID and Description | Vendor ID | Format | Size K | Rev # | Date Last Modified |
| AN923 — 800 MHz Test Fixture Design Application Note | NXP | 183 | 0 | 7/20/1993 | |
| AN1617 — Mounting Recommendations for Copper Tungsten Flanged Transistors Application Note | NXP | 82 | 0 | 3/19/1997 | |
| AN1643 — RF LDMOS Power Modules for GSM Base Station Application: Optimum Biasing Current - Application Note | NXP | 88 | 0 | 1/31/1998 | |
| AN1907 — AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages | NXP | 889 | 3 | 5/13/2009 | |
| AN1908 — AN1908 - Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages | NXP | 649 | 1 | 2/24/2011 | |
| AN1923 — Mounting Method with Mechanical Fasteners for the MRF19090 and Similar Packages Application Note | NXP | 466 | 0 | 4/10/2001 | |
| AN1949 — Mounting Method for the MHVIC910HR2 PFP-16 and Similar Surface Mount Packages Application Note | NXP | 595 | 0 | 2/05/2003 | |
| AN1977 — Quiescent Current Control for the RF Integrated Circuit Device Family - AN1977 | NXP | 110 | 0 | 10/09/2003 | |
| AN1987 — Quiescent Current Control for the RF Integrated Circuit Device Family - AN1987 | NXP | 108 | 1 | 5/12/2004 | |
| AN3263 — Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over-Molded Plastic Packages | NXP | 8024 | 0 | 6/07/2006 | |
| AN3789 — Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages | NXP | 403 | 0 | 3/12/2009 | |
| AN4005 — Thermal Management and Mounting Method for the PLD 1.5 RF Power Surface Mount Package Application Note | NXP | 111 | 0 | 11/14/1997 |