Design Files
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2.4 GHz Front-End IC for Wi-Fi® 7, Wi-Fi 6E and Bluetooth®
For additional information contact support, your local sales representative or an NXP Authorized Distributor.
The WLAN7301HC is a 2.4 GHz front-end IC for Wi-Fi 7 and Bluetooth. Available as a 2.1 mm x 1.7 mm x 0.225 mm flip chip die with copper pillar bumps.
The WLAN7301HC includes a transmit power amplifier with five transmit modes for WLAN and two transmit modes for Bluetooth. The WLAN7301HC receive path contains a low noise amplifier with two receive modes and a bypass mode. The Bluetooth amplifier can be separately bypassed.
An integrated directional power coupler allows for output power monitoring in all transmit modes.
The power modes allow optimization of RF performance versus current consumption. Providing excellent power efficiency across typical use cases.
Note: To prevent reliability issues of Cu-pillar products, it is mandatory to select a molded underfill material (MUF) with less than 20 ppm chlorides as per the material supplier specifications.
Product Details
Features
- Supports Wi-Fi 7 and Bluetooth
- Highly linear Wi-Fi transmit amplifier
- 5 Wi-Fi transmit modes for high power efficiency
- 2 Bluetooth transmit modes for high power efficiency
- 2 receive modes for low current consumption
- Modes for bypassing the Bluetooth and the receive amplifier
- Power monitoring on all transmit modes
- All RF pins are matched to 50 Ω
- AC coupled RF pins except for the ANT and BT_BP pins
- ESD protection on all pins
Part numbers include: WLAN7301HC.
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