Package Information (1)
Packing Information (1)
Supporting Information (2)
-
Footprint for reflow soldering[SSOP-TSSOP-VSO-REFLOW]
-
Footprint for wave soldering[SSOP-TSSOP-VSO-WAVE]
Sign in for a personalized NXP experience.
Archived content is no longer updated and is made available for historical reference only.
| | | | | |
---|---|---|---|---|---|
| | | | | |
| | | | | |
| | | | | |
| | | | | |
| | | | | |
| | | | | |
| | | | | |
| | | | | |
| | | | | |
| | | | | |
Quick reference to our documentation types.
4 documents
Compact List
There are no results for this selection.
Please wait while your secure files are loading.
4 documents
Compact List
Receive the full breakdown. See the product footprint and more in the eCad file.
There are no recently viewed products to display.