Surface Mount to DIP Evaluation Board

OM13495 Archived
  • This page contains information on a product that is no longer manufactured (discontinued). Specifications and information herein are available for historical reference only.

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The OM13495 allows one to evaluate small, surface mount devices by breaking out the package leads to 100 mil centers pins, emulating a DIP package. The OM13495 supports the following packages: TSSOP24, (SOT355), TSSOP20, (SOT360), TSSOP16, (SOT403), TSSOP14, (SOT402).

Product Details

Features

Key Features

  • Allows evaluation of device that is only available in surface mount packages
  • Eliminates costly sockets and custom printed circuit boards
  • Expand the kit with add-on I²C daughter cards
  • 100 mil center headers emulate DIP package for easy bread boarding

Connectivity

  • Easy connection to small surface mount packages

Documentation

Quick reference to our documentation types.

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