Surface Mount to DIP Evaluation Board

OM13494 Archived
  • This page contains information on a product that is no longer manufactured (discontinued). Specifications and information herein are available for historical reference only.

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The OM13494 allows one to evaluate small, surface mount devices by breaking out the package leads to 100 mil centers pins, emulating a DIP package. The OM13494 supports the following packages: HVQFN24 (SOT616), HVQFN20 (SOT662), HVQFN16 (SOT758), HVQFN14 (SOT629).

Product Details

Features

Key Features

  • 100 mil center headers emulate DIP package for easy bread boarding
  • Allows evaluation of device that is only available in surface mount packages
  • Eliminates costly sockets and custom printed circuit boards

Connectivity

  • Easy connection to small surface mount packages
  • Expand the kit with add-on I²C daughter cards

Documentation

Quick reference to our documentation types.

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