User Guide (1)
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OM13491, OM13492, OM13493, OM13494, OM13495, OM13496, OM13497 Breakout Board[UM10754]Getting Started
- No Longer Manufactured
- OM13494
Surface Mount to DIP Evaluation Board
- This page contains information on a product that is no longer manufactured (discontinued). Specifications and information herein are available for historical reference only.
The OM13494 allows one to evaluate small, surface mount devices by breaking out the package leads to 100 mil centers pins, emulating a DIP package. The OM13494 supports the following packages: HVQFN24 (SOT616), HVQFN20 (SOT662), HVQFN16 (SOT758), HVQFN14 (SOT629).
Product Details
Features
Key Features
- 100 mil center headers emulate DIP package for easy bread boarding
- Allows evaluation of device that is only available in surface mount packages
- Eliminates costly sockets and custom printed circuit boards
Connectivity
- Easy connection to small surface mount packages
- Expand the kit with add-on I²C daughter cards
Documentation
Quick reference to our documentation types.
1 document
1 documents
User Guide (1)
-
OM13491, OM13492, OM13493, OM13494, OM13495, OM13496, OM13497 Breakout Board[UM10754]Getting Started
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