Surface Mount to DIP Evaluation Board

OM13492 Archived
  • This page contains information on a product that is no longer manufactured (discontinued). Specifications and information herein are available for historical reference only.

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OM13492 allows one to evaluate small, surface mount devices by breaking out the package leads to 100 mil centers pins, emulating a DIP package. The OM13492 supports the following packages: MSOP10 (SOT552-1), HVSON10 (SOT650-1), XSON8U (SOT996-2), TSSOP8 (SOT530-1), HVSON8 (SOT908-1), WLCSP6 (PCT2202UK), and TSOP6 (SOT457, SOT1353-1).

Product Details

Features

Connectivity

  • Expand the kit with add-on I²C daughter cards
  • Easy connection to small surface mount packages

Key Features

  • Allows evaluation of device that is only available in surface mount packages
  • 100 mil center headers emulate DIP package for easy bread boarding
  • Eliminates costly sockets and custom printed circuit boards

Documentation

Quick reference to our documentation types.

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1 documents

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