QPSK satellite tuner with integrated high-sensitivity LNA and loop-through | NXP Semiconductors

QPSK satellite tuner with integrated high-sensitivity LNA and loop-through

  • This page contains information on a product that is no longer manufactured (discontinued). Specifications and information herein are available for historical reference only.

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Buy/Parametrics

1 result

Exclude 1 NRND

CAD Model

Supply voltage

Package Type

Noise figure [Typ] (dB)

Return loss [Typ] (input (dB))

Total power consumption [Typ] (mW)

Frequency range (MHz)

Loop-Through (LT)

3, 3

HVQFN28

6

-10

710

966 - 2150

Y

N true 0 PSPTDA20143en 2 Application Note Application Note t789 1 Package Information Package Information t790 1 en_US en_US en Application Note Application Note 1 1 9.0 English Provides Assembly guidelines for QFN and SON packages handling and board mounting. Including recommendations for printed-circuit board (PCB) design, soldering, and rework. NOTE: combined with AN10365. 112GNLnm PSP 9.3 MB None None documents None 112GNLnm /docs/en/application-note/AN1902.pdf 9332633 /docs/en/application-note/AN1902.pdf AN1902 documents N N 2016-10-31 AN1902: Assembly Guidelines for QFN and SON Packages Application Note /docs/en/application-note/AN1902.pdf /docs/en/application-note/AN1902.pdf Application Note N 645036621402383989 2023-06-08 pdf N en Mar 30, 2021 645036621402383989 Application Note Y N AN1902: Assembly Guidelines for QFN and SON Packages Application Note Package Information Package Information 1 2 1.0 English 1455078817901703336759 PSP 223.0 KB None None documents None 1455078817901703336759 /docs/en/package-information/SOT993-3.pdf 223000 /docs/en/package-information/SOT993-3.pdf SOT993-3 documents N 2016-02-09 HVQFN28: plastic thermal enhanced very thin quad flat package; no leads; 28 terminals /docs/en/package-information/SOT993-3.pdf /docs/en/package-information/SOT993-3.pdf Package Information N 302435339416912908 2022-12-07 pdf en Feb 8, 2016 302435339416912908 Package Information Y N HVQFN28: plastic thermal enhanced very thin quad flat package; no leads; 28 terminals false 0 TDA20143 downloads en true 1 Y PSP Application Note 1 /docs/en/application-note/AN1902.pdf 2016-10-31 112GNLnm PSP 1 Mar 30, 2021 Application Note Provides Assembly guidelines for QFN and SON packages handling and board mounting. Including recommendations for printed-circuit board (PCB) design, soldering, and rework. NOTE: combined with AN10365. None /docs/en/application-note/AN1902.pdf English documents 9332633 None 645036621402383989 2023-06-08 N /docs/en/application-note/AN1902.pdf AN1902: Assembly Guidelines for QFN and SON Packages Application Note /docs/en/application-note/AN1902.pdf documents 645036621402383989 Application Note N en None Y pdf 9.0 N N AN1902: Assembly Guidelines for QFN and SON Packages Application Note 9.3 MB AN1902 N 112GNLnm Package Information 1 /docs/en/package-information/SOT993-3.pdf 2016-02-09 1455078817901703336759 PSP 2 Feb 8, 2016 Package Information None /docs/en/package-information/SOT993-3.pdf English documents 223000 None 302435339416912908 2022-12-07 /docs/en/package-information/SOT993-3.pdf HVQFN28: plastic thermal enhanced very thin quad flat package; no leads; 28 terminals /docs/en/package-information/SOT993-3.pdf documents 302435339416912908 Package Information N en None Y pdf 1.0 N HVQFN28: plastic thermal enhanced very thin quad flat package; no leads; 28 terminals 223.0 KB SOT993-3 N 1455078817901703336759 true Y Products

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