Car radio Digital Signal Processor (DSP) | NXP Semiconductors

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Car radio Digital Signal Processor (DSP)

SAF7741HV
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  • This page contains information on a product that is no longer manufactured (discontinued). Specifications and information herein are available for historical reference only.

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Our single-chip SAF7740 and SAF7741 gives you a highly integrated, powerful and economical solution with system and design flexibility, incorporating extensive functionality and including the most advanced processing algorithms.

The ideal DSP engine to beat at the heart of your car radio designs, the SAF7740 and SAF7741 family also features fully integrated IF processing, significantly reducing external filter circuitry. Intelligent power management and clocking along with various ESD improvements enhance the solution's robustness. In addition, an improved grounding strategy results in less ground-bounce, better EMC and improved overall performance.

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SAF7741HV

HLQFP144

N true 0 PSPSAF7741HVen 1 Package Information Package Information t790 1 en_US en_US en Package Information Package Information 1 1 1.0 English 1455079211579695758412 PSP 865.0 KB None None documents None 1455079211579695758412 /docs/en/package-information/SOT612-3.pdf 865042 /docs/en/package-information/SOT612-3.pdf SOT612-3 documents N N 2016-02-12 plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad /docs/en/package-information/SOT612-3.pdf /docs/en/package-information/SOT612-3.pdf Package Information N 302435339416912908 2022-12-07 pdf N en Jun 8, 2016 302435339416912908 Package Information Y N plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad false 0 SAF7741HV downloads en true 1 Y PSP Package Information 1 /docs/en/package-information/SOT612-3.pdf 2016-02-12 1455079211579695758412 PSP 1 Jun 8, 2016 Package Information None /docs/en/package-information/SOT612-3.pdf English documents 865042 None 302435339416912908 2022-12-07 N /docs/en/package-information/SOT612-3.pdf plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad /docs/en/package-information/SOT612-3.pdf documents 302435339416912908 Package Information N en None Y pdf 1.0 N N plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad 865.0 KB SOT612-3 N 1455079211579695758412 true Y Products

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