The advent of 3G technology opens up a wide range of multimedia applications in mobile information appliances. The LH7A404 is designed from the ground up with a 32‑bit Arm922T™ Core to provide high processing performance, low power consumption, and a high level of integration. Features include 80 kB on-chip SRAM, fully static design, power management unit, low voltage (1.8 V Core, 3.3 V I/O) and on-chip PLL.
NOTE:
Devices containing lead-free solder formulations have different reflow temperatures than leaded-solder formulations. When using both solder formulations on the same PC board, designers should consider the effect of different reflow temperatures on the overall PCB assembly process. Refer to www.nxp.com for an application note on recommended SOT1021-1 soldering practices.
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Quick reference to our documentation types.
4 documents
2 design files
Receive the full breakdown. See the product footprint and more in the eCad file.
