Surface Mount to DIP Evaluation Board

OM13497 Archived
  • This page contains information on a product that is no longer manufactured (discontinued). Specifications and information herein are available for historical reference only.

Roll over image to zoom in

The OM13497 allows one to evaluate small, surface mount devices by breaking out the package leads to 100 mil centers pins, emulating a DIP package. The OM13497 supports the following packages: VFBGA24 (SOT1199-1), XFBGA24 (SOT1342-1), HTSSOP24 (SOT1172-2).

Product Details

Features

Key Features

  • Allows evaluation of device that is only available in surface mount packages
  • Eliminates costly sockets and custom printed circuit boards
  • 100 mil center headers emulate DIP package for easy bread boarding

Connectivity

  • Easy connection to small surface mount packages
  • Expand the kit with add-on I²C daughter cards

Documentation

Quick reference to our documentation types.

Filters

1 documents

Support

What do you need help with?

Search