202303023F01 : I.MX31_Auto molding compound change from G770FL to G770SFL
NXP Semiconductors is announcing the successful qualification of molding compound change from G770FL to G770SFL (low alpha) for i.MX31 AUTO 19*19 BGA parts. G770SFL (low alpha) had better performance than G770FL on SER failure rate. Corresponding ZVEI Delta Qualification Matrix ID: SEM-PA-11
| PCN Type | Change Category | Issue Date | Effective Date |
|---|---|---|---|
| Final Product Change Notification | Assembly materials | 08-Apr-2023 | 07-Jul-2023 |
Reason of Change
Molding compound change from G770FL to G770SFL (low alpha) will improve SER performance. Molding compound G770FL and G770SFL (low alpha) have same composition. G770SFL (low alpha) molding compound has better control on alpha particle than G770FL
Affected Parts
| Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
|---|---|---|---|
|
MCIMX31CJMN4D (935325483557) |
- | - | - |
|
MCIMX31CVMN4D (935321891557) |
- | - | - |
|
MCIMX31LCVMN4D (935319427557) |
- | - | - |
|
MCIMX31LCVMN4DR2 (935319427518) |
- | - | - |