202009025A:APCN NX20P5090UK FAB EXPANSION SSMC TO TSMC F10
  • Product Change Notification (PCN)
  • 202009025A

202009025A : APCN NX20P5090UK FAB EXPANSION SSMC TO TSMC F10

NXP Semiconductor is annoucing the introduction of Taiwan Semiconductor Manufacturing Compony Fab10 (TSMC F10) Shanghai China as a dual source wafer manufacturing location for the NX20P5090UK.Reason for change:The fab manufacturing site capacity expansion to TSMC F10 will improve NXP's ability to meet increasing customer demand and still maintain supply from the original fab (SSMC).Identification of affected products:Line C marking XtDYYWW X = foundry location "Z" is for SSMC and "N" is for TSMC F10.

PCN Type Change Category Issue Date
Advanced Product Change Notification Wafer fab location 30-Sep-2020

Reason of Change

The fab manufacturing site capacity expansion to TSMC F10 will improve NXP's ability to meet increasing customer demand and still maintain supply from the original fab (SSMC).

Identification of Affected Products

Top side marking

Anticipated Impact

Data sheet revision: A new datasheet will be issued

No impact on form fit function reliability or quality.

Timing and Logistics

The Final PCN is planned to be issued on 21-Jan-2021

Affected Parts

Part Number / 12NC Last Time Buy Date Last Time Delivery Date Replacement Part
NX20P5090UKAZ
(935305697041)
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