202009012A:APCN NX5P3363 FAB EXPANSION SSMC TO TSMC F10
  • Product Change Notification (PCN)
  • 202009012A

202009012A : APCN NX5P3363 FAB EXPANSION SSMC TO TSMC F10

NXP Semiconductor is annoucing the introduction of Taiwan Semiconductor Manufacturing Company Fab10 (TSMC F10) Shanghai China as a dual source wafer manufacturing location for the NX5P3363UK.Reason for change:The fab manufacturing site capacity expansion to TSMC F10 will improve NXP's ability to meet increasing customer demand and still maintain supply from the original fab (SSMC).Identification of affected products:Line C marking XtDYYWW X = foundry location "Z" is for SSMC and "N" is for TSMC F10.

PCN Type Change Category Issue Date
Advanced Product Change Notification Wafer fab location 19-Sep-2020

Reason of Change

The fab manufacturing site capacity expansion to TSMC F10 will improve NXP's ability to meet increasing customer demand and still maintain supply from the original fab (SSMC).

Identification of Affected Products

Top side marking

Anticipated Impact

Data sheet revision: No impact to existing datasheet

No impact on form fit function reliability or quality.

Timing and Logistics

The Final PCN is planned to be issued on 23-Nov-2020

Affected Parts

Part Number / 12NC Last Time Buy Date Last Time Delivery Date Replacement Part
NX5P3363UKZ
(935354625012)
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