201912009F01 : i.MXRT106A FAB Site Transfer from SMIC8 to SMICB2
NXP Semiconductors announces the Wafer Fabrication site transfer for i.MXRT106A from the current SMIC8 Shanghai China Wafer Fabrication site to the SMICB2 Beijing China Wafer Fabrication site.Wafer Fabrication site transfer was successfully qualified adhering to NXP specifications.
PCN Type | Change Category | Issue Date | Effective Date |
---|---|---|---|
Final Product Change Notification | Wafer fab location | 22-Dec-2019 | 21-Mar-2020 |
Reason of Change
SMIC8 wafer Fabrication site will cease production for 40nm technology and therefore NXP is moving production of i.MXRT106A to internal SMICB2 Wafer Fabrication site.Qualification of SMICB2 Wafer Fabrication site is required for customer supply assurance.
Identification of Affected Products
There is no change to orderable part number. NXP will have traceability by ECID
Anticipated Impact
No impact on form fit function reliability or quality.
Affected Parts
Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
---|---|---|---|
MIMXRT106ADVL6A (935385521557) |
- | - | - |
MIMXRT106ADVL6AR (935385521518) |
- | - | - |
MIMXRT106FDVL6A (935389817557) |
- | - | - |
MIMXRT106LDVL6A (935389818557) |
- | - | - |