201912009F01:i.MXRT106A FAB Site Transfer from SMIC8 to SMICB2
  • Product Change Notification (PCN)
  • 201912009F01

201912009F01 : i.MXRT106A FAB Site Transfer from SMIC8 to SMICB2

NXP Semiconductors announces the Wafer Fabrication site transfer for i.MXRT106A from the current SMIC8 Shanghai China Wafer Fabrication site to the SMICB2 Beijing China Wafer Fabrication site.Wafer Fabrication site transfer was successfully qualified adhering to NXP specifications.

PCN Type Change Category Issue Date Effective Date
Final Product Change Notification Wafer fab location 22-Dec-2019 21-Mar-2020

Reason of Change

SMIC8 wafer Fabrication site will cease production for 40nm technology and therefore NXP is moving production of i.MXRT106A to internal SMICB2 Wafer Fabrication site.Qualification of SMICB2 Wafer Fabrication site is required for customer supply assurance.

Identification of Affected Products

There is no change to orderable part number. NXP will have traceability by ECID

Anticipated Impact

No impact on form fit function reliability or quality.

Affected Parts

Part Number / 12NC Last Time Buy Date Last Time Delivery Date Replacement Part
MIMXRT106ADVL6A
(935385521557)
- - -
MIMXRT106ADVL6AR
(935385521518)
- - -
MIMXRT106FDVL6A
(935389817557)
- - -
MIMXRT106LDVL6A
(935389818557)
- - -