201911006F01 : i.MXRT1064 Redistribution Layer Addition On Flash Die
NXP Semiconductors announces to add a RDL layer (Redistribution Layer) to separate the probing and wire bond pads on flash die for i.MXRT1064. The original bond pads and RDL pads are going to be on separate locations. Original bond pads are used for wafer test probing while RDL pads are for wire bonding process.
| PCN Type | Change Category | Issue Date | Effective Date |
|---|---|---|---|
| Final Product Change Notification | Wafer fab process | 06-Dec-2019 | 05-Mar-2020 |
Reason of Change
This is to separate the probing and wire bond pads on flash die for manufacturing robustness.
Identification of Affected Products
Product identification does not change
Anticipated Impact
No impact on form fit function reliability or quality.
Affected Parts
| Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
|---|---|---|---|
|
MIMXRT1064CVL5A (935377468557) |
- | - | - |
|
MIMXRT1064DVL6A (935377469557) |
- | - | - |
|
MIMXRT1064DVL6AR (935377469518) |
- | - | - |