201903005F01W : Withdrawal: ASEK Grinding/Sawing Transferring to ATKH - NX20P5090UK WITHDRAWAL
Expanding the current flow which is currently limited to an ASE Assembly to allow for ATKH BE2 (back half of the Assembly process). The flow allows for manufacturing flexibility and helps ensure customer supply. BE2(back half of the Assembly process) (grinding/sawing/marking and Packing) will be enabled in ATKH. There's no change in Form Fit or Function.
| PCN Type | Change Category | Issue Date | Effective Date |
|---|---|---|---|
| Final Product Change Notification | Other | 13-May-2022 | 11-Aug-2022 |
Reason of Change
Expanding the current flow which is currently limited to an ASE Assembly to allow for ATKH BE2. The flow allows for manufacturing flexibility and helps ensure customer supply.
Update Information
NXP decided to stop the NX20P5090 BE2 expansion because the current ASEK has enough capacity to support customer demands.
Anticipated Impact
Data sheet revision: No impact to existing datasheet
Affected Parts
| Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
|---|---|---|---|
|
NX20P5090UKAZ (935305697041) |
- | - | - |