201802016F01 : MMA8491Q ASECL Transfer and Copper Wire Qualification
NXP Semiconductors announces the assembly transfer of the MMA8491Q product from the Carsem Malaysia assembly site to the ASE-ChungLi Taiwan (ASECL) assembly site. This product was qualified with a material change from Gold (Au) bond wire Sumitomo EME-G770HCD mold compound and Henkel 8006NS (Screen Print) die attach film material to Gold Palladium Copper (AuPdCu) bond wire Sumitomo EME-G700LA version P mold compound and Ablestik die attach film ATB-F125E.
| PCN Type | Change Category | Issue Date | Effective Date |
|---|---|---|---|
| Final Product Change Notification | Assembly location, Assembly materials, Assembly process | 20-Jun-2019 | 18-Sep-2019 |
Reason of Change
The assembly transfer to ASECL is for consolidation of NXP assembly sites. The change from Gold to Gold Palladium Copper bond wire is to align with industry standards for bond wire material type. The change of the mold compound and die attach material is to standardize the bill of materials at the ASECL assembly site.
Identification of Affected Products
Product identification does not change There is no change to the orderable part numbers. NXP will have traceability of the assembly site by the 1st and 2nd digit of the tracecode.
Anticipated Impact
Data sheet revision: No impact to existing datasheet
No impact on form fit function reliability or quality.
Affected Parts
| Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
|---|---|---|---|
|
MMA8491QR1 (935310644547) |
- | - | - |
|
MMA8491QR2 (935310644528) |
- | - | - |