201802016A : MMA8491Q ASECL Transfer and Copper Wire Qualification
NXP Semiconductors announces the assembly transfer of MMA8491Q to ASE-ChungLi Taiwan (ASECL) assembly site. These products were previously assembled at the Carsem Malaysia assembly site.NXP Semiconductors ASE-Chungli Taiwan (ASECL) assembled MMA8491Q products are qualified with the materials change to Gold Palladium Copper (AuPdCu) wire Sumitomo EME-G700LA version P mold compound and Ablestik die attach film ATB-F125E. These products were previously assembled with Gold (Au) wire Sumitomo EME-G770HCD mold compound and Henkel 8006NS (Screen Print) die attach film material.
| PCN Type | Change Category | Issue Date |
|---|---|---|
| Advanced Product Change Notification | Assembly location, Assembly materials, Assembly process | 02-Mar-2018 |
Reason of Change
The transfer to ASECL is for consolidation of our assembly sites. The transfer from Gold to Gold Palladium Copper wire is an alignment to industry standard convention for wirebond material type. The change to mold compound and die attach material for QFN 3x3 package is required to standardize the bill of materials for ASECL assembly production.
Identification of Affected Products
Product identification does not change There is no change to the orderable part numbers. NXP will have traceability of the assembly site by the 1st and 2nd digit of the tracecode.
Anticipated Impact
Data sheet revision: No impact to existing datasheet
No impact on form fit function reliability or quality.
Timing and Logistics
The Final PCN is planned to be issued on 27-Jul-2018
Affected Parts
| Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
|---|---|---|---|
|
MMA8491QR1 (935310644547) |
- | - | - |
|
MMA8491QR2 (935310644528) |
- | - | - |