201708001I : UCODE 7 12inch - Change of wafer map origin coordinates
Standardization of origin of coordinates in NXP manufacturing sitesDuring UCODE7 12inch ramp-up origin of coordinates have been placed at wafer center which is not according to NXP standard. Reason: at ramp-up start in August 2016 not all manufacturing tools could handle row & column count > 512 Impact: positive and negative coordinates in wafer maps.Current status: all manufacturing tools are upgraded to handle row & column count > 512 which allows to place the origin from wafer center outside the wafer according to NXP standard. Impact: only positive coordinates in wafer maps.In addition to this standardization the wafer layout has been optimized to increase NDPW.
| PCN Type | Change Category | Issue Date | Effective Date |
|---|---|---|---|
| Customer Information Notification | Test equipment | 07-Aug-2017 | 04-Nov-2017 |
Reason of Change
Standardization of origin of coordinates in NXP manufacturing sites.
Identification of Affected Products
Product identification does not change
Anticipated Impact
Data sheet revision: No impact to existing datasheet
No impact on form fit function reliability or quality.
Affected Parts
| Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
|---|---|---|---|
|
SL3S1204FUD2/BG1A (935330567046) |
- | - | - |
|
SL3S1204FUD2/BG1BZ (935330567045) |
- | - | - |