201707009A : S12ZVL128/64 32QFN Assembly Site Expansion from ATP3(Amkor Binan Laguna Philippines) to ASE (Chung Li Taiwan)
NXP Semiconductors is announcing the assembly site expansion for S12ZVL128/64 32QFN from the current Amkor Binan Laguna Philippines (ATP3) assembly facility to ASE Chung Li Taiwan (ASE-CL) assembly facility.The mold compound wire type and wire diameter will be identical between the two assembly sites.ATP3 is qualified with die attach epoxy Sumitomo CRM1085A and with an exposed pad size of 3.7 x 3.7mm.ASE-CL will qualify with die attach epoxy Hitachi EN-4900G and with an exposed pad size of 3.6 x 3.6mm.The lead frame dimensions will have difference visually under X-ray with no change in base and plating material. No change to package case outline.Expected qualification of ASE-CL is in September 2017. An update to this notification with qualification results will be issued at that time.
| PCN Type | Change Category | Issue Date |
|---|---|---|
| Advanced Product Change Notification | Assembly location | 31-Jul-2017 |
Reason of Change
Qualification of ASE-CL as assurance of customer supply
Identification of Affected Products
The assembly site among other information is reflected in the package trace code. Please refer to the marking comparisons file in the attachment.
Anticipated Impact
No impact on form fit function reliability or quality.
Timing and Logistics
The Final PCN is planned to be issued on 18-Sep-2017
Affected Parts
| Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
|---|---|---|---|
|
S912ZVLA12F0MFM (935318534557) |
- | - | - |
|
S912ZVLA64F0VFM (935346489557) |
- | - | - |
|
S912ZVLA64F0VFMR (935346489578) |
- | - | - |