201702014F01 : Introduction of Powerchip as an additional wafer fab source for MIFARE Classic EV1
Installation of Powerchip as an additional wafer fab for capacity enhancements to the already existing wafer fab source TSMC. The copy exact concept is applied to install the existing process at Powerchip. Powerchip will operate under the same conditions at equal performance and with comparable systems processes and equipment. The affected products are currently delivered in contactless modules using TSMC wafer fab. As a consequence of the present change an additional wafer supplier is qualified. Each reel of modules delivered by NXP contains only one source of wafer fab. However for commercial deliveries containing more than one reel different reels may contain different sources of wafer fab.
| PCN Type | Change Category | Issue Date | Effective Date |
|---|---|---|---|
| Final Product Change Notification | Wafer fab location | 13-Feb-2017 | 14-May-2017 |
Reason of Change
The implementation of this second source will increase production capacity and flexibility.
Identification of Affected Products
Product identification does not change Products from current wafer fabs and Powerchip will have the same ordering code (12NC).
Anticipated Impact
Data sheet revision: No impact to existing datasheet
No impact to the product's functionality.No impact on form fit function reliability or quality.
Affected Parts
| Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
|---|---|---|---|
|
MF1S5000XDA4/V1J (935302816118) |
- | - | None |
|
MF1S5000XDA8/V1J (935302824118) |
- | - | None |
|
MF1S5030XDA4/V1J (935302818118) |
- | - | None |
|
MF1S5030XDA8/V1J (935302825118) |
- | - | None |