XPC823EZT66BA Product Information|NXP

XPC823EZT66BA

No Longer Manufactured

XPC823EZT66BA

No Longer Manufactured

Features


PORTABLE SYSTEM MPU

    Package


    BGA256: BGA256, plastic, ball grid array; 256 balls; 1.27 mm pitch; 23 mm x 23 mm x 2.54 mm body

    Buy Options

    XPC823EZT66BA

    No Longer Manufactured

    12NC: 935324198557

    Details

    Order

    Operating Features

    No information available

    Environmental

    Part/12NCPbFreeEU RoHSRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
    XPC823EZT66BA(935324198557)
    No
    No
    N
    e0
    REACH SVHC
    1724.05

    Quality

    Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
    Lead SolderingLead SolderingLead Soldering
    XPC823EZT66BA
    (935324198557)
    No
    3
    220
    30

    Shipping

    Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
    XPC823EZT66BA
    (935324198557)
    854231
    3A991A2

    Product Change Notice

    Part/12NCIssue DateEffective DatePCNTitle
    XPC823EZT66BA
    (935324198557)
    2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label