TEF8101EN1 Product Information|NXP

Package


WFBGA155: plastic very-very-thin fine-pitch ball grid array package; 155 balls, 0.5 mm pitch, 7.5 mm x 7.5 mm x 0.62 mm body

Buy Options

TEF8101EN1/N1Y

End of Life

12NC: 935397966518

Details

Order

TEF8101EN1/N1ZY

No Longer Manufactured

12NC: 935381879518

Details

Order

Operating Features

No information available

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF IndicatorREACH SVHCWeight (mg)
TEF8101EN1/N1Y(935397966518)
Yes
Yes
Yes
DREACH SVHC
62.63
TEF8101EN1/N1ZY(935381879518)
Yes
Yes
Yes
DREACH SVHC
80.001

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)
Lead SolderingLead Free SolderingLead SolderingLead Free Soldering
TEF8101EN1/N1Y
(935397966518)
ISO 26262
1
1
240
260
TEF8101EN1/N1ZY
(935381879518)
ISO 26262
1
1
240
260

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)CCATS
TEF8101EN1/N1Y
(935397966518)
854239
TEF8101EN1/N1ZY
(935381879518)
854239
EAR99
-

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
TEF8101EN1/N1Y
(935397966518)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label