SVF522R2N2CMK4 Product Information|NXP

Package


LFBGA364: LFBGA364, plastic, low profile fine-pitch ball grid array; 364 bumps; 0.8 mm pitch; 17 mm x 17 mm x 1.33 mm body

Buy Options

Operating Features

No information available

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF IndicatorREACH SVHCWeight (mg)
SVF522R2N2CMK4(935381011557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
1389.6

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
SVF522R2N2CMK4
(935381011557)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)CCATS
SVF522R2N2CMK4
(935381011557)
854231
5A992C
G173573

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
SVF522R2N2CMK4
(935381011557)
2025-04-162025-05-26202504009IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
SVF522R2N2CMK4
(935381011557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label