SPC5747CSK0AVMJ2 Product Information|NXP

Package


LBGA256: LBGA256; plastic, low profile ball grid array; 256 bumps; 1.0 mm pitch; 17 mm x 17 mm x 1.7 mm body

Buy Options

Operating Features

No information available

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
SP5747CSK0AVMJ2R(935371595518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
798.1905
SPC5747CSK0AVMJ2(935371595557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
798.1905

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
SP5747CSK0AVMJ2R
(935371595518)
ISO 26262
3
260
40
SPC5747CSK0AVMJ2
(935371595557)
ISO 26262
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)CCATS
SP5747CSK0AVMJ2R
(935371595518)
854231
5A992C
G173419
SPC5747CSK0AVMJ2
(935371595557)
854231
5A992C
G173419

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
SP5747CSK0AVMJ2R
(935371595518)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
SPC5747CSK0AVMJ2
(935371595557)
SP5747CSK0AVMJ2R
(935371595518)
2019-02-012019-02-02201901025IMPC5748G and MPC5746C Reference Manual and Datasheet Update
SPC5747CSK0AVMJ2
(935371595557)