SPC5744PEK1AMMM5 Product Information|NXP

Package


LFBGA257: LFBGA257, plastic, low profile fine-pitch ball grid array package; 257 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.35 mm body

Buy Options

Operating Features

No information available

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
SPC5744PEK1AMMM5(935364718557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
405.3368

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
SPC5744PEK1AMMM5
(935364718557)
ISO 26262
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
SPC5744PEK1AMMM5
(935364718557)
854231
3A991A2

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
SPC5744PEK1AMMM5
(935364718557)
2021-10-302021-10-31202108018IMPC5644A MPC5642A MPC563xM MPC5604P MPC5643L and MPC5744P Errata Update
SPC5744PEK1AMMM5
(935364718557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
SPC5744PEK1AMMM5
(935364718557)
2018-07-252018-10-23201806005F01MPC574xP Safety Manual Update from Rev. 3 to Rev.4
SPC5744PEK1AMMM5
(935364718557)
2018-04-132018-04-14201712018IMPC5744P Data Sheet Update to Rev 6.1