SPC5744CFK1ACMH2 Product Information|NXP

Package


LBGA100: LBGA100, plastic, low profile ball grid array; 100 balls; 1 mm pitch; 11 mm x 11 mm x 1.27 mm body

Buy Options

Operating Features

No information available

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF IndicatorREACH SVHCWeight (mg)
SPC5744CFK1ACMH2(935382358557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
280.2

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
SPC5744CFK1ACMH2
(935382358557)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)CCATS
SPC5744CFK1ACMH2
(935382358557)
854231
5A992C
G173419

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
SPC5744CFK1ACMH2
(935382358557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
SPC5744CFK1ACMH2
(935382358557)
2019-03-272019-04-28201901008IMPC5746C 100MAPBGA and 256MAPBGA Site Expansion: Burn-In from TTM to TTTJ and Final Test from NXP-ATKL to NXP-ATTJ
SPC5744CFK1ACMH2
(935382358557)
2019-02-012019-02-02201901025IMPC5748G and MPC5746C Reference Manual and Datasheet Update