SPC5643LK0MMM1 Product Information|NXP

Features


Freescale 32-bit MCU, Dual Power Arch, 1MB Flash, 120MHz, -40/+125degC, Automotive Qual, MAPBGA 257

    Package


    LFBGA257: LFBGA257, plastic, low profile fine-pitch ball grid array package; 257 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.35 mm body

    Buy Options

    SPC5643LK0MMM1

    Active

    12NC: 935339332557

    Details

    Order

    Order from distributors

    Operating Features

    No information available

    Environmental

    Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
    SPC5643LK0MMM1(935339332557)
    Yes
    Yes
    Certificate Of Analysis (CoA)
    Yes
    D
    e2
    REACH SVHC
    407.2

    Quality

    Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
    Lead Free SolderingLead Free SolderingLead Free Soldering
    SPC5643LK0MMM1
    (935339332557)
    ISO 26262
    3
    260
    40

    Shipping

    Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
    SPC5643LK0MMM1
    (935339332557)
    854231
    3A991A2

    Product Change Notice

    Part/12NCIssue DateEffective DatePCNTitle
    SPC5643LK0MMM1
    (935339332557)
    2025-04-162025-05-26202504009IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
    SPC5643LK0MMM1
    (935339332557)
    2022-11-192022-11-20202209023IMPC5604P Mask 1M36W MPC5643L Mask 0N18H and 2N89D Errata Update SEP2022
    SPC5643LK0MMM1
    (935339332557)
    2021-10-302021-10-31202108018IMPC5644A MPC5642A MPC563xM MPC5604P MPC5643L and MPC5744P Errata Update
    SPC5643LK0MMM1
    (935339332557)
    2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label