SCIMX6QP6AVT7AA Product Information|NXP

Package


FBGA624: FBGA624; plastic, fine-pitch ball grid array; 624 bumps; 0.8 mm pitch; 21 mm x 21 mm x 2 mm body

Buy Options

SCIMX6QP6AVT7AA

Active

12NC: 935387277557

Details

Order

Operating Features

No information available

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF IndicatorREACH SVHCWeight (mg)
SCIMX6QP6AVT7AA(935387277557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
3295.022

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
SCIMX6QP6AVT7AA
(935387277557)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)CCATS
SCIMX6QP6AVT7AA
(935387277557)
854231
5A992
G159000

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
SCIMX6QP6AVT7AA
(935387277557)
2025-04-162025-05-26202504009IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
SCIMX6QP6AVT7AA
(935387277557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
SCIMX6QP6AVT7AA
(935387277557)
2019-07-142019-07-15201805041IU01iMX6DQ+ iMX6DQ iMX6SDL iMX6SL iMX6SX Reference Manual Updates