Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Features
16-bit MCU, S12 core, 32KB Flash, 32MHz, -40/+125degC, Automotive Qualified, QFP 64
Package
LQFP64: LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body
Buy Options
S9S12HY32J0MLH
Active
12NC: 935317117557
Details
Order
Operating Features
| Parameter | Value |
|---|---|
Flash (kB) | 32 |
RAM (kB) | 2 |
EEPROM (kB) | 4 |
Operating Frequency [Max] (MHz) | 32 |
CAN | 1 |
| Parameter | Value |
|---|---|
SPI | 1 |
Supply Voltage [max] (V) | 5.5 |
Supply Voltage [min] (V) | 4.5 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 125 |
GPIO | 50 |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
S9S12HY32J0MLH(935317117557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e4 | REACH SVHC | 346.55 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Free Soldering | Lead Free Soldering | Lead Free Soldering | |||||
S9S12HY32J0MLH (935317117557) | No | 3 | 260 | 40 | |||
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) |
|---|---|---|
S9S12HY32J0MLH (935317117557) | 854231 | 3A991A2 |
Product Change Notice
| Part/12NC | Issue Date | Effective Date | PCN | Title |
|---|---|---|---|---|
S9S12HY32J0MLH (935317117557) | 2025-04-16 | 2025-05-26 | 202504008I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
S9S12HY32J0MLH (935317117557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
More about S12HY
The S12HY family of CAN MCUs offers enhanced 16-bit performance and customized features, such as LCD driver and stepper motor driver, for cost-effective instrument cluster applications—helping you design for emerging markets in the automotive industry.