MPC823CVR66B2T Product Information|NXP

Features


POWER QUICC

    Package


    BGA256: BGA256, plastic, ball grid array; 256 balls; 1.27 mm pitch; 23 mm x 23 mm x 2.54 mm body

    Buy Options

    Operating Features

    No information available

    Environmental

    Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
    MPC823CVR66B2T(935321108557)
    Yes
    Yes
    Certificate Of Analysis (CoA)
    Yes
    D
    e1
    REACH SVHC
    1662.95

    Quality

    Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
    Lead Free SolderingLead Free SolderingLead Free Soldering
    MPC823CVR66B2T
    (935321108557)
    No
    3
    260
    40

    Shipping

    Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
    MPC823CVR66B2T
    (935321108557)
    854231
    3A991A2

    Discontinued and Replacement Part Data

    Part/12NCDiscontinuance NoticeLast Time Buy DateLast Time Delivery DateReplacement
    MPC823CVR66B2T
    (935321108557)
    -
    2013-12-03
    2014-12-03
    MPC8358CVRADDDA
    (935325268557)

    Product Change Notice

    Part/12NCIssue DateEffective DatePCNTitle
    MPC823CVR66B2T
    (935321108557)
    2025-04-162025-05-26202504007IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
    MPC823CVR66B2T
    (935321108557)
    2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
    MPC823CVR66B2T
    (935321108557)
    2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments